The 12-inch (300mm) silicon carbide substrate is a next-generation large-diameter wafer engineered for high-performance semiconductor manufacturing. Based on 4H-N SiC single-crystal technology, this prime-grade substrate offers exceptional electrical, thermal, and mechanical properties, making it ideal for high-power, high-frequency, and high-temperature device applications.
With the transition from 6-inch to 8-inch and now 12-inch platforms, SiC wafers significantly improve chip yield, lower cost per device, and accelerate mass production of power electronics.
12inch-Sic-wafer
| Параметр | ZeroMPD Production Grade (Z Grade) | Standard Production Grade (P Grade) | Dummy Grade (D Grade) |
|---|---|---|---|
| Диаметр | 300 mm | 300 mm | 300 mm |
| Thickness | 750μm ± 15μm | 750μm ± 25μm | 750μm ± 25μm |
| Wafer Orientation | Off axis: 4.0° towards <1120> ±0.5° for 4H-N | On axis: <0001> ±0.5° for 4H-SI | — |
| Micropipe Density (MPD) | 4H-N: ≤0.4 cm⁻²; 4H-SI: ≤5 cm⁻² | 4H-N: ≤4 cm⁻²; 4H-SI: ≤10 cm⁻² | 4H-N: ≤25 cm⁻²; 4H-SI: ≤25 cm⁻² |
| Сопротивление | 4H-N: 0.015 ~ 0.024 Ω·cm | 4H-N: 0.015 ~ 0.028 Ω·cm | 4H-SI: ≥1E10 Ω·cm; 4H-SI: ≥1E5 Ω·cm |
| Primary Flat Orientation | {10-10} ±5.0° | {10-10} ±5.0° | {10-10} ±5.0° |
| Primary Flat Length | N/A | Notch | Notch |
| Edge Exclusion | 3 mm | 3 mm | 3 mm |
| LTV/TTV/Bow/Warp | ≤5μm/ ≤15μm/ ≤35μm/ ≤55μm | ≤5μm/ ≤15μm/ ≤35μm/ ≤55μm | ≤5μm/ ≤15μm/ ≤35μm/ ≤55μm |
| Roughness | Polish Ra ≤1 nm; CMP Ra ≤0.2 nm | Ra ≤0.5 nm | Ra ≤0.5 nm |
| Edge Cracks by High Intensity Light | None | None | Cumulative length ≤ 20 mm, single length ≤ 2 mm |
| Hex Plates by High Intensity Light | None | None | Cumulative area ≤ 0.1% |
| Polytype Areas by High Intensity Light | None | None | Cumulative area ≤ 3% |
| Visual Carbon Inclusions | None | None | Cumulative area ≤ 3% |
| Silicon Surface Scratches | None | None | Cumulative length ≤ 1 × wafer diameter |
| Edge Chips by High Intensity Light | None permitted ≥0.2mm width and depth | 7 allowed, ≤1 mm each | 7 allowed, ≤1 mm each |
| Threading Screw Dislocation (TSD) | ≤500 cm⁻² | N/A | N/A |
| Base Plane Dislocation (BPD) | ≤1000 cm⁻² | N/A | N/A |
| Silicon Surface Contamination by High Intensity Light | None | None | None |
| Packaging | Multi-wafer cassette or single wafer container | Multi-wafer cassette or single wafer container | Multi-wafer cassette or single wafer container |
SiC provides thermal conductivity over three times that of silicon, enabling efficient heat dissipation in high-power systems such as EV inverters and industrial converters.
The breakdown field strength of 4H-SiC is nearly an order of magnitude higher than silicon, supporting high-voltage and high-reliability applications.
A broad bandgap enables stable operation under high temperature, high frequency, and harsh environmental conditions.
Mohs hardness of 9.2 offers excellent wear resistance and mechanical robustness during device processing.
SiC maintains structural and electrical stability in corrosive, high-temperature, and high-stress manufacturing environments.
Prime-grade 12-inch (300mm) wafers help customers increase throughput, optimize device design, and reduce long-term production costs.
Advanced crystal growth and wafering technologies ensure uniformity, high epitaxial compatibility, and stable device performance.
SiC MOSFETs for EV traction inverters, industrial drives, PV inverters
Schottky Barrier Diodes (SBDs) for high-efficiency rectification
Power modules operating in high-voltage and high-current environments
RF power amplifiers for 5G base stations
Microwave devices for radar, satellite communication, and phased-array systems
On-board chargers (OBC)
Fast-charging power conversion modules
High-efficiency traction system components
Smart grid HVDC systems
High-voltage inverters and power control equipment
Industrial automation & robotics
High-temperature electronics
Radiation-resistant and extreme-environment devices
Wide bandgap semiconductor device R&D
Advanced epitaxy, doping, and material characterization
Various crystal orientations, resistivities, surface finish levels (CMP, epi-ready), and wafer thickness options are available.
Technical guidance for epitaxy, lithography, doping, thinning, and device fabrication ensures seamless production compatibility.
Strict defect inspection including:
Micropipe analysis
BPD/TSD mapping
Surface particle monitoring
Flatness and uniformity measurements
We work closely with customers on new device structures, large-diameter wafer development, and next-generation SiC technology innovation.
The 12-inch 4H-N silicon carbide substrate represents a major milestone in the evolution of wide bandgap semiconductors. Its superior thermal conductivity, high breakdown strength, and large-size platform make it a core material for future high-power and high-efficiency electronic systems.
Whether for electric vehicles, power grids, RF systems, or aerospace, 300mm SiC wafers deliver performance, scalability, and reliability for next-generation semiconductor manufacturing.
